Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641741 | Microelectronic devices with tiered blocks separated by progressively spaced slits, and related methods and systems | Sarfraz Qureshi, Md Zakir Ullah, Jessica Jing Wen Low, Harsh Narendrakumar Jain, Kok Siak Tang +2 more | 2023-05-02 |
| 11600630 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more | 2023-03-07 |