Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639420 | Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board | Te-Chao Liao, Hao-Sheng Chen, Chi-Lin Chen | 2023-05-02 |