Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639420 | Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board | Te-Chao Liao, Hao-Sheng Chen, Hung-Yi Chang | 2023-05-02 |
| 11579109 | Method of calculating dielectric constant and dielectric loss of polymer material | Te-Chao Liao, Meng-Huai Han | 2023-02-14 |