Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11795293 | Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device | Kazuya KIGUCHI, Tomoo NISHIYAMA, Daisuke Fujimoto | 2023-10-24 |
| 11581212 | Prepreg for coreless substrate, coreless substrate and semiconductor package | Hiroshi Yokota, Shintaro Hashimoto, Shinji Tsuchikawa, Katsuhiko Nawate, Shin Takanezawa | 2023-02-14 |