Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581212 | Prepreg for coreless substrate, coreless substrate and semiconductor package | Hiroshi Yokota, Shintaro Hashimoto, Norihiko Sakamoto, Katsuhiko Nawate, Shin Takanezawa | 2023-02-14 |