Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11831105 | High density receptacle | Teng-Kai Chen, Li Zhuang | 2023-11-28 |
| 11652321 | Backplane connector for providing angled connections and system thereof | Chien-Lin Wang, Vivek Shah | 2023-05-16 |