Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11831105 | High density receptacle | Teng-Kai Chen, John C. Laurx | 2023-11-28 |
| 11682864 | Shielded connector assemblies with temperature and alignment controls | Andrew Kolak, Dominic Steier, Scott D. Sommers | 2023-06-20 |