Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735434 | Method for producing insulating circuit substrate with heat sink | Ryouhei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2023-08-22 |
| 11676882 | Method of manufacturing power module substrate board and ceramic-copper bonded body | Takeshi Kitahara, Tomoya Oohiraki | 2023-06-13 |