Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735434 | Method for producing insulating circuit substrate with heat sink | Ryouhei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2023-08-22 |
| 11676882 | Method of manufacturing power module substrate board and ceramic-copper bonded body | Tomoya Oohiraki, Yoshiyuki Nagatomo | 2023-06-13 |
| 11546921 | Wireless communication apparatus and server apparatus | Hidenori Akita, Ryo Tamura, Keisuke Kunitomo, Takuya Miyasaka, Osamu Kobayashi +1 more | 2023-01-03 |