Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702504 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | Shohei Yamaguchi, Katsuya Tomizawa, Hidetoshi Kawai | 2023-07-18 |