Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769607 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Yoichi Takano, Meguru Ito, Eisuke Shiga | 2023-09-26 |
| 11718708 | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board | Mayumi Kikuchi, Hidetoshi Kawai | 2023-08-08 |
| 11702504 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | Shohei Yamaguchi, Norihiro Shida, Hidetoshi Kawai | 2023-07-18 |