Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742251 | Power semiconductor device including press-fit connection terminal | Hidetoshi Ishibashi, Yoshitaka Kimura, Nobuhiro Asaji, Kazunari Teshigawara | 2023-08-29 |
| 11631653 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Shingo Sudo, Kazuyuki Hashimoto, Erubi SUZUKI | 2023-04-18 |