Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631653 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Minoru Egusa, Shingo Sudo, Kazuyuki Hashimoto | 2023-04-18 |