Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574834 | Devices, systems and methods for electrostatic force enhanced semiconductor bonding | Shu Qin | 2023-02-07 |
| 11555635 | Systems and methods for cooling electrical equipment | John Costakis | 2023-01-17 |