Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735516 | Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring | Yaojian Leng | 2023-08-22 |
| 11723222 | Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate | Yaojian Leng, Bomy Chen | 2023-08-08 |
| 11715757 | Three-dimensional metal-insulator-metal (MIM) capacitor | Yaojian Leng | 2023-08-01 |
| 11682642 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Bomy Chen, Andrew Taylor | 2023-06-20 |
| 11682641 | Integrated circuit bond pad with multi-material toothed structure | Bomy Chen, Yaojian Leng, Gerald Marsico, Julius Kovats | 2023-06-20 |
| 11670583 | Integrated inductor with a stacked metal wire | Yaojian Leng | 2023-06-06 |
| 11626474 | Thin-film resistor (TFR) with improved contacts | Yaojian Leng | 2023-04-11 |
| 11545544 | Three-dimensional metal-insulator-metal (MIM) capacitor | Yaojian Leng | 2023-01-03 |