Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682641 | Integrated circuit bond pad with multi-material toothed structure | Justin Sato, Bomy Chen, Yaojian Leng, Julius Kovats | 2023-06-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682641 | Integrated circuit bond pad with multi-material toothed structure | Justin Sato, Bomy Chen, Yaojian Leng, Julius Kovats | 2023-06-20 |