Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11807006 | Inkjet printhead assembly with wirebond protection | — | 2023-11-07 |
| 11701883 | Inkjet printhead having robust encapsulation of wirebonds | Elmer Dimaculangan Perez, See-Huat Tan, Mohammad Istiaque Hossain, Michael John Webb, Pascal Blanquer +1 more | 2023-07-18 |