Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11701883 | Inkjet printhead having robust encapsulation of wirebonds | Elmer Dimaculangan Perez, See-Huat Tan, Glenn Horrocks, Michael John Webb, Pascal Blanquer +1 more | 2023-07-18 |