Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., Richard Hurtubise | 2023-07-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., Richard Hurtubise | 2023-07-11 |