Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11846018 | Method and wet chemical compositions for diffusion barrier formation | Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao | 2023-12-19 |
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander | 2023-07-11 |