Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749576 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, Michael J. Anderson, Yucheng Ying | 2023-09-05 |