Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11844178 | Electronic component | Sok Mun Chew | 2023-12-12 |
| 11749576 | Stacked circuit package with molded base having laser drilled openings for upper package | Frederick E. Beville, David R. Ng, Michael J. Anderson, Yucheng Ying | 2023-09-05 |