Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11668558 | Thickness estimation method and processing control method | Wansung Park, Doohyun Cho, Sungha Kim, Jaeyoun Wi, Kijoo HONG +4 more | 2023-06-06 |
| D981973 | Reactor wall for substrate processing apparatus | Jaehyun Kim, Jeongho Lee, JinHo Shin | 2023-03-28 |
| 11579096 | Wafer inspection apparatus and method | Sungha Kim, Hyounggon Kim, Doohyun Cho, Kwangsung Lee, Taejoong Kim +1 more | 2023-02-14 |