Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798231 | Method for generating hollow structure based on 2D laminated cross-sectional outline for 3D printing | Hye In Lee, Hwa Seon Shin, Sung Hwan Chun, Sung Hun Park | 2023-10-24 |
| 11613082 | Method for producing 3D mesh surface characteristic-based support for laminate manufacturing | Hwa Seon Shin, Hye In Lee, Sung Hwan Chun, Sung Hun Park | 2023-03-28 |