Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798231 | Method for generating hollow structure based on 2D laminated cross-sectional outline for 3D printing | Hye In Lee, Sung Hwan Chun, Sung Hun Park, Ji Min Jang | 2023-10-24 |
| 11613082 | Method for producing 3D mesh surface characteristic-based support for laminate manufacturing | Hye In Lee, Sung Hwan Chun, Ji Min Jang, Sung Hun Park | 2023-03-28 |
| 11548227 | Method for monitoring 3D printing equipped with 3D printing slicer and recursive loop structure | Sung Hwan Chun, Hye In Lee | 2023-01-10 |