Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840619 | Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board | Yoshitaka Takezawa, Fusao Hojo | 2023-12-12 |
| 11698336 | Analysis method and analysis apparatus | Kenichi Tsutsumi, Akihiro Tanaka, Kazushiro Yokouchi, Tatsuya Uchida, Noboru Taguchi | 2023-07-11 |
| 11592077 | Vibration damping device | Ryuichi Ando, Kenji Oki, Yusuke Arai, Keisuke Kawabe | 2023-02-28 |
| 11566626 | Vacuum pump | — | 2023-01-31 |