Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840600 | Cured epoxy resin material, epoxy resin composition, molded article, and composite material | Kazumasa Fukuda, Naoki Maruyama, Yuka Yoshida, Tomoko Higashiuchi | 2023-12-12 |
| 11840619 | Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board | Shingo Tanaka, Fusao Hojo | 2023-12-12 |
| 11814568 | Anisotropic thermal conductive resin member and manufacturing method thereof | Masahiro Nomura | 2023-11-14 |
| 11560476 | Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material | Naoki Maruyama, Yuka Yoshida, Tomoko Higashiuchi, Kazumasa Fukuda, Keiichiro Nishimura | 2023-01-24 |