Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688715 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera | 2023-06-27 |
| 11664239 | Lead frame for improving adhesive fillets on semiconductor die corners | Maiden Grace Maming, Jefferson Talledo | 2023-05-30 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2023-01-10 |