Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848256 | Semiconductor package having die pad with cooling fins | — | 2023-12-19 |
| 11715677 | Semiconductor device with frame having arms | Rammil Seguido | 2023-08-01 |
| 11699667 | Leadframe with pad anchoring members and method of forming the same | — | 2023-07-11 |
| 11664239 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2023-05-30 |
| 11658098 | Leadframe package with side solder ball contact and method of manufacturing | Tito Mangaoang | 2023-05-23 |
| 11610851 | Die embedded in substrate with stress buffer | — | 2023-03-21 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2023-01-10 |
| 11542152 | Semiconductor package with flexible interconnect | — | 2023-01-03 |