HT

Hsien Yu Tseng

TSMC: 2 patents #1,466 of 4,064Top 40%
Overall (2023): #150,172 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11687698 Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects Amit Kundu, Chun-Wei Chang, Szu-Lin Liu, Sheng-Feng Liu 2023-06-27
11658049 Electromigration evaluation methodology with consideration of thermal and signal effects Sheng-Feng Liu 2023-05-23