Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11687698 | Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects | Hsien Yu Tseng, Amit Kundu, Chun-Wei Chang, Szu-Lin Liu | 2023-06-27 |
| 11658049 | Electromigration evaluation methodology with consideration of thermal and signal effects | Hsien Yu Tseng | 2023-05-23 |
| 11616124 | Method of making fin field effect transistor (FinFET) device | Jhong-Sheng Wang, Jiaw-Ren Shih, Chun-Wei Chang | 2023-03-28 |