Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817406 | Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods | Durodami LISK, Jinying Sun | 2023-11-14 |
| 11676922 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Li-Sheng Weng, Yangyang SUN | 2023-06-13 |