Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848292 | Pad design for thermal fatigue resistance and interconnect joint reliability | Sireesha Gogineni, Yuhong Cai | 2023-12-19 |
| 11749653 | Multi-die, vertical-wire package-in-package apparatus, and methods of making same | Hyoung Il Kim, Florence R. Pon | 2023-09-05 |
| 11710674 | Embedded component and methods of making the same | Bilal Khalaf, Dennis Sean Carr | 2023-07-25 |
| 11694976 | Bowl shaped pad | Yuhong Cai, Sireesha Gogineni | 2023-07-04 |
| 11658079 | Temporary interconnect for use in testing a semiconductor package | Hyoung Il Kim, Florence R. Pon | 2023-05-23 |
| 11652031 | Shrinkable package assembly | Florence R. Pon, Min-Tih Lai | 2023-05-16 |
| 11569144 | Semiconductor package design for solder joint reliability | Yuhong Cai | 2023-01-31 |
| 11566275 | Chromatin immunocapture devices and methods of use | Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more | 2023-01-31 |
| 11545464 | Diode for use in testing semiconductor packages | Hyoung Il Kim, Florence R. Pon | 2023-01-03 |