Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791207 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Craig Bishop | 2023-10-17 |
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Robin Davis, Paul R. Hoffman, Clifford Sandstrom | 2023-09-05 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Robin Davis, Craig Bishop, Clifford Sandstrom | 2023-08-15 |
| 11664321 | Multi-step high aspect ratio vertical interconnect and method of making the same | Clifford Sandstrom, Craig Bishop | 2023-05-30 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Clifford Sandstrom, Craig Bishop, Robin Davis | 2023-03-28 |