Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Robin Davis, Paul R. Hoffman, Timothy L. Olson | 2023-09-05 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Robin Davis, Timothy L. Olson, Craig Bishop | 2023-08-15 |
| 11664321 | Multi-step high aspect ratio vertical interconnect and method of making the same | Craig Bishop, Timothy L. Olson | 2023-05-30 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Timothy L. Olson, Craig Bishop, Robin Davis | 2023-03-28 |