Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11668558 | Thickness estimation method and processing control method | Jongsu Kim, Wansung Park, Doohyun Cho, Jaeyoun Wi, Kijoo HONG +4 more | 2023-06-06 |
| 11579096 | Wafer inspection apparatus and method | Hyounggon Kim, Doohyun Cho, Kwangsung Lee, Jongsu Kim, Taejoong Kim +1 more | 2023-02-14 |