Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11687757 | Integrated circuit, wireless communication card and wiring structure of identification mark | Shyh-Bin Kuo, Hsiang-Chi Cheng, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsing Hung | 2023-06-27 |
| 11610921 | Chip having a flexible substrate | Hsiang-Chi Cheng, Yi-Cheng Lai, Shyh-Bin Kuo, Kuo-Hsiang Chen, Yu WANG +1 more | 2023-03-21 |