Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610921 | Chip having a flexible substrate | Hsiang-Chi Cheng, Yi-Cheng Lai, Sin-Jie Wang, Shyh-Bin Kuo, Yu WANG +1 more | 2023-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610921 | Chip having a flexible substrate | Hsiang-Chi Cheng, Yi-Cheng Lai, Sin-Jie Wang, Shyh-Bin Kuo, Yu WANG +1 more | 2023-03-21 |