Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749614 | Through-silicon via (TSV) key for overlay measurement, and semiconductor device and semiconductor package including TSV key | Yongyeop Kim, Eunji Kim, Kwangwuk Park, Jihak Yu | 2023-09-05 |
| 11617619 | System and method for detecting application of grounding pad for ablation devices | Binesh Balasingh, William Winstrom | 2023-04-04 |