Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Paul R. Hoffman, Clifford Sandstrom, Timothy L. Olson | 2023-09-05 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Timothy L. Olson, Craig Bishop, Clifford Sandstrom | 2023-08-15 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Timothy L. Olson, Clifford Sandstrom, Craig Bishop | 2023-03-28 |