Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830817 | Creating interconnects between dies using a cross-over die and through-die vias | Rahul Agarwal, Michael Alfano, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more | 2023-11-28 |
| 11709327 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Kong-Toon Ng, Rahul Agarwal | 2023-07-25 |