{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2023", "item": "https://www.patentleaderboard.com/2023/"}, {"@type": "ListItem", "position": 3, "name": "AMD", "item": "https://www.patentleaderboard.com/2023/company/amd"}, {"@type": "ListItem", "position": 4, "name": "Michael Alfano", "item": "https://www.patentleaderboard.com/2023/inventor/fl:mi_ln:alfano-1"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
MA

Michael Alfano — 1 Patent in 2023

AMD: 1 patents #441 of 933Top 50%
Austin, TX: #1,133 of 3,047 inventorsTop 40%
Texas: #5,594 of 16,648 inventorsTop 35%
Overall (2023): #329,153 of 537,848Top 65%
1 Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11830817 Creating interconnects between dies using a cross-over die and through-die vias Rahul Agarwal, Raja Swaminathan, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more 2023-11-28 $314,875,000