Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778817 | Three-dimensional memory device including III-V compound semiconductor channel layer and method of making the same | Ashish Baraskar, Raghuveer S. Makala | 2023-10-03 |
| 11728305 | Capacitor structure including bonding pads as electrodes and methods of forming the same | Shiqian Shao, Fumiaki Toyama | 2023-08-15 |
| 11721727 | Three-dimensional memory device including a silicon-germanium source contact layer and method of making the same | Ashish Baraskar, Raghuveer S. Makala | 2023-08-08 |
| 11676954 | Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same | Masaaki Higashitani, Kwang Ho Kim | 2023-06-13 |
| 11646283 | Bonded assembly containing low dielectric constant bonding dielectric material | Lin Hou, Masaaki Higashitani, Ramy Nashed Bassely Said | 2023-05-09 |
| 11646081 | Reliability compensation for uneven NAND block degradation | Xiang Yang, Henry Chin, Ken Oowada, Dengtao Zhao, Gerrit Jan Hemink | 2023-05-09 |
| 11646282 | Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same | Lin Hou, Masaaki Higashitani | 2023-05-09 |
| 11569215 | Three-dimensional memory device with vertical field effect transistors and method of making thereof | Kwang Ho Kim | 2023-01-31 |
| 11562975 | Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same | Lin Hou, Masaaki Higashitani | 2023-01-24 |