Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824028 | Die with metal pillars | Christophe Lebrere | 2023-11-21 |
| 11784104 | Method of forming electronic chip package having a conductive layer between a chip and a support | Romain Jaillet | 2023-10-10 |
| 11581304 | Protection device | — | 2023-02-14 |
| 11574816 | Method for manufacturing electronic chips | Michael DE CRUZ | 2023-02-07 |