Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784104 | Method of forming electronic chip package having a conductive layer between a chip and a support | Olivier Ory | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784104 | Method of forming electronic chip package having a conductive layer between a chip and a support | Olivier Ory | 2023-10-10 |