Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569136 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Yaojian Lin | 2023-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569136 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Yaojian Lin | 2023-01-31 |