Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742340 | Semiconductor package including stacked semiconductor chips | Seung Yeop Lee | 2023-08-29 |
| 11682627 | Semiconductor package including an interposer | Jae-Hoon Lee | 2023-06-20 |
| 11682643 | Semiconductor chip having chip pads of different surface areas, and semiconductor package including the same | Woo Jin Lee, Hyung Ho Cho | 2023-06-20 |
| 11605615 | Semiconductor package and semiconductor module including the same | Byung Jun Bang | 2023-03-14 |