Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715708 | Semiconductor package including decoupling capacitor | Jae-Hoon Lee | 2023-08-01 |
| 11682643 | Semiconductor chip having chip pads of different surface areas, and semiconductor package including the same | Ju-il Eom, Woo Jin Lee | 2023-06-20 |