Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787690 | MEMS assembly substrates including a bond layer | Sung Bok Lee, John B. Szczech | 2023-10-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787690 | MEMS assembly substrates including a bond layer | Sung Bok Lee, John B. Szczech | 2023-10-17 |