| 11854912 |
Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad |
Yonghwan Kwon, Sanguk Kim |
2023-12-26 |
| 11798862 |
Semiconductor package |
Eunseok Cho, Minjeong Gu, Jaehoon Choi |
2023-10-24 |
| 11791230 |
Fan-out semiconductor package |
Doohwan Lee, Jinseon Park |
2023-10-17 |
| 11735532 |
Semiconductor packages |
Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park |
2023-08-22 |
| 11689262 |
Communication device for performing beamforming and operating method thereof |
Yongin Choi, Yangsoo Kwon, Jinwoo Oh, Mingoo Kim, Inhyoung Kim +2 more |
2023-06-27 |
| 11574868 |
Fan-out semiconductor packages |
Khaile Kim |
2023-02-07 |
| 11569957 |
Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervals |
Yangsoo Kwon, Yongin Choi |
2023-01-31 |
